project | technical standard | Remark | ||
Number of layers | 1-10 layers | 12-16 layers can be produced in small batches | ||
Material | CEM-3, FR-4 |
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Board thickness | 0.3mm-3.20mm (12mil-126mil) |
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Minimum core thickness | 0.1mm(4mil) |
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Copper thickness | 1/2 oz min;3 oz max. |
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Minimum line width/spacing | 0.1mm(4mil) |
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Minimum hole diameter | 0.25mm(10mil) |
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Minimum punching aperture | 0.9mm(35mil) |
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tolerance | Drilling hole position | ±0.075mm(3mil) |
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Line width | ±0.1mm(4mil) or ±20% of line width |
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Aperture | PTH±0.1mm(4mil) NPTH±0.075mm(3mil) |
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Overall tolerance | Milling machine ±0.15MM(6mil) Punch machine ±0.10mm(4mil) |
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Warpage | 0.70%-1% |
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Pad surface treatment | Nickel/Gold Plating/ |
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Insulation resistance | 10KΩ-20MΩ |
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Conduction resistance | < 50Ω |
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Test voltage | 150-300V |
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V carve | Jigsaw size | 110 × 100mm (min.) 660 × 600mm (max.) |
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Board thickness | 0.6mm (24mil) min. |
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Retain thickness | 0.3mm(12mil)min. |
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tolerance | ±0.1mm(4mil) |
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Slot width | 0.50mm(20mil)max. |
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Slot to slot | 10mm min. |
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Slot to line | 0.50mm(20mil)min. | |||
groove | Slot size tol.>=2W tolerance | PTH L:±0.15mm(6mil) | Where:L=Slot length | |
NPTH L:±0.125mm(5mil) | ||||
Minimum hole to circle distance | PTH Hole:0.13mm(5mil) | |||
NPTH Hole:0.18(7mil) |
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Registration Tolerance of | Circular deviation | 0.075mm(3mil) |
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Multilayer board
| Interlayer deviation | 4 layers:0.15mm(6mil)max. | ||
6 layers:0.025mm(10mil)max. | ||||
Minimum hole to inner circle distance | 0.25mm(10mil) | |||
Minimum distance from board edge to inner circle | 0.25mm(10mil) | |||
Board thickness tolerance | 4 layers:±0.13mm(5mil) | |||
6 layers:±0.15mm(6mil) | ||||
Characteristic impedance | 60 ohm±10% | |||
product name: | Double-sided matt green oil spray tin plate | |||
Product Description: | Spray tin plate: Process characteristics: Including copper and tin two layers of metal, in which Cu≥25μm, Sn≥5.0μm, its characteristics are that it can adapt to poor environmental conditions and has good soldering performance. It is a more suitable process in high temperature and corrosive environment. The matt solder mask can protect the eyes of the welding workers and will not reflect light. It is generally required for European orders . | |||
Product name : | Black solder mask double-sided nickel-plated gold plate | |||
Product Description: | Nickel-plated gold plate: Process characteristics: The plating layer contains three layers of copper, nickel and gold, in which Ni≥2.5μm, AU≥0.02μm, which is characterized by large internal stress of the coating, good flatness and high wear resistance. However, the solderability is relatively poor. Scope of application: BONGDING boards and plug-in boards, general communication products, computer boards and consumer electronics, electronic toys, game consoles, etc.
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product name: | 3-layer tin plate | |||
Product Description: | Spray tin plate: Process characteristics: Including copper and tin two layers of metal, in which Cu≥25μm, Sn≥5.0μm, its characteristics are that it can adapt to poor environmental conditions and has good soldering performance. It is a more suitable process in high temperature and corrosive environment. | |||
product name: | 4-layer tin spray resistance board | |||
Product Description: | Process characteristics: Including two layers of copper and tin, in which Cu≥25μm and Sn≥5.0μm, which are characterized by being able to adapt to poor environmental conditions and having good soldering properties. It is a more suitable process in high temperature and corrosive environment. | |||
product name: | Double-sided spray tin board | |||
Product Description: | Spray tin plate: | |||
product name: | 4- layer nickel-plated gold plate | |||
Product Description: | Nickel-plated gold plate: | |||
product name: | Spray tin plus gold finger board | |||
Product Description: | Gold finger tin-spraying board: | |||
product name: | 6-layer spray tin board | |||
Product Description: | Spray tin plate: | |||
product name: | Double-sided nickel-plated gold plate | |||
Product Description: | Nickel-gold plate: | |||
